KOMEG offer temperature and humidity testing chambers that aid in determining reliability of the product
based on rigorous conditions it may be prone to due to temperature conditions.
| Application object | Test purposes | Test conditions | Guideline |
|---|---|---|---|
| Semiconductor industry | Bias damp heat test | 85℃,85%RH,Test time 1000h | JESD22-A101 |
| Highly Accelerated Stress Test | 133℃,85%RH,Bias 250Kpa,Test time 96h | JESD22-A110 | |
| Unbiased Highly Accelerated Stress Test | 110℃,85%RH。Test time264h | JESD22-A118 | |
| High pressure cooking test | 121℃,100%RH,Test time96h | JESD22-A101 | |
| Discrete device | Aging test | ≥125℃,Test time48-168h | JESD22-A108 |
| High temperature reverse bias test | 125℃,150℃or175℃,Test time168h,500h,1000h | JESD22-A108 | |
| High temperature grid bias test | 150℃or175℃,Test time 500h,1000h | JESD22-A108 | |
| Early failure level testing | Early failure level testing | JESD22-A108-A ElAJED-4701-D101 | |
| Optoelectronic devices | High/low temperature operation life cycle test | 1000 hours test at 125°C for 4 years, 2000 hours test for 8 years | MIT-STD-883E JESD22-A108-A |
| Accelerated Temperature Humidity and Bias Test | 85℃,85%RH | JESD22-A101-D | |
| Highly Accelerated Temperature Humidity and Bias Test | 130℃,85%RH,relative pressure | JESD22-A110 | |
| High pressure cooking test | 130℃,85%RH,relative pressure | JESD22-A102 | |
| Sensor | High and low temperature cycle test | Condition A:-55℃ to 125℃ Condition B:-65℃ to 150℃ | MIT-STD-883E JESD22-A104-A |
| High and low temperature impact test | Condition A:-55℃ to 125℃ Condition B:-65℃ to 150℃ | MIT-STD-883E JESD22-B106 | |
| High temperature storage test | 150℃ | MIT-STD-883E JESD22-B103 | |
| Soldering heat durability test | Immerse in 260℃ tin basin for 10 seconds | MIT-STD-883E |