Electronics

Electronics Solution

ICs, circuit boards, power supplies,fuses, switches, connectors etc. need to be properly tested
for temperature durability before they make their way into a finished product.

KOMEG offers a variety of condition-based testing environments that simulate the rigorous
conditions the product may endure during its use.

Application Products

The following is only for reference and is not used as the inspection standard of the relevant industry (it is also being updated with the technical iteration test)

Application object	Test	Test purposes	Test equipment
machine structure	Low temperature test High temperature test Damp heat test	Inspect the body structure for deformation or damage	High temperature test chamber High and low temperature (humid heat) test chamber
electronic system	Low temperature test high temperature test Damp heat test	Investigate whether the electronic equipment can work normally, its sensitivity and anti-interference ability	High temperature test chamber High and low temperature (humid heat) test chamber
Control System	Low temperature test High temperature test Damp heat test	Investigate whether the systems work together, whether the operation stability, function and performance status are good	High and low temperature (humid heat) test chamber